IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

Name:
IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

Published Date:
05/30/2007

Status:
Active

Description:

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Publisher:
International Electrotechnical Commission - Publicly Available Standard

Document status:
Active

Format:
Electronic (PDF)

Delivery time:
10 minutes

Delivery time (for Russian version):
200 business days

SKU:

Choose Document Language:
$69
Need Help?
Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types
Edition : 1.0
File Size : 1 file , 370 KB
Note : This product is unavailable in Canada
Number of Pages : 31
Published : 05/30/2007

History


Related products


Best-Selling Products