IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

Name:
IEC/PAS 61249-3-1 Ed. 1.0 en:2007 PDF

Published Date:
05/30/2007

Status:
Active

Description:

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Document status:

Active

Format:

Electronic (PDF)

Delivery time:

10 minutes

Delivery time (for Russian version):

200 business days

SKU:

Specifies the properties of copper-clad laminates used for flexible printed wiring boards for both adhesive and non-adhesive types

Edition :	1.0
File Size :	1 file , 370 KB
Note :	This product is unavailable in Canada
Number of Pages :	31
Published :	05/30/2007

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